| 名(míng)稱 | 6052E低(dī)熱膨脹(zhàng)係數聚酰(xiān)亞(yà)胺(àn)薄(báo)膜 |
| 更新(xīn)時(shí)間 | 2024-09-04 |
| 訪問(wèn)量 | 1532 |
| 特點 | 低(dī)熱膨脹(zhàng)係(xì)數聚(jù)酰亞(yà)胺薄膜(mó)是(shì)由(yóu)新型(xíng)酐單體及新(xīn)型胺單體的(dí)新(xīn)配方製(zhì)成(chéng)的聚酰氨(ān)酸(suān)樹脂，經雙(shuāng)向拉(lā)伸工(gōng)藝(yì)生(shēng)產(chǎn)的新型亞胺薄膜(mó)，它(tā)不僅(jǐn)具(jù)有普通(tōng)聚酰亞胺薄膜(mó)的(dí)所有優(yōu)異(yì)性能，且具(jù)有(yǒu)更(gēng)高(gāo)的(dí)尺寸(cùn)穩定(dìng)性，高彈性(xìng)模(mó)量(liáng)及(jí)低(dī)熱膨(péng)脹係數。} |
- 詳細內(nèi)容
6052E低(dī)熱膨脹(zhàng)係(xì)數聚酰亞胺薄膜
低熱膨(péng)脹係數聚酰亞(yà)胺薄膜是由新型酐單(dān)體(tǐ)及新型胺單(dān)體(tǐ)的新配方製(zhì)成(chéng)的聚酰氨酸樹脂，經(jīng)雙(shuāng)向(xiàng)拉伸(shēn)工藝(yì)生產(chǎn)的新型亞胺(àn)薄(báo)膜(mó)，它(tā)不(bù)僅(jǐn)具(jù)有(yǒu)普通聚(jù)酰亞(yà)胺(àn)薄(báo)膜的所有優異(yì)性能，且具(jù)有更高的(dí)尺寸穩定性(xìng)，高彈(dàn)性模量(liáng)及(jí)低熱膨脹(zhàng)係數。
6052E低熱膨脹(zhàng)係數(shù)聚酰(xiān)亞胺(àn)薄膜
一(yī)，技(jì)術要(yào)求：
1，厚度與寬(kuān)度(dù)
| 標稱厚度 | 12.5 | 25.0 |
| 允(yǔn)許偏(piān)差 | +1/-1 | +1/-2 |
| ≤520 | ≤520 | |
| 注(zhù)：厚(hòu)度(dù)也可根(gēn)據用戶要求供應(yīng)。 | ||
2，性能指(zhǐ)標
序號 | 指標名稱 | 單位(wèi) | 指標值(zhí) | ||
12.5μm | 25.0μm | ||||
1 | 拉伸(shēn)強(qiáng)度 | 縱向及(jí)橫向(xiàng) | MPa | ≥200 | |
2 | 斷裂伸(shēn)長度率 | 縱(zòng)向及橫(héng)向(xiàng) | % | ≥40 | |
| 3 | 拉(lā)伸(shēn)模量 | 縱向(xiàng)及橫向(xiàng) | GPa | ≥4.0 | |
4 | 熱收縮(suō)率(shuài) 縱向及(jí)橫(héng)向 | % | ≤0.1 | ||
5 | 工(gōng)頻(pín)電(diàn)氣強度 | 平均(jūn)值(zhí) | MV/m | ≥200 | |
6 | 熱(rè)膨(péng)脹係數(shù) 25-200℃ | ppm/℃ | 15-25 | ||
吸濕性 100%RH | % | ≤2.5 | |||
7 | 體(tǐ)積電(diàn)阻率(shuài)200℃ | Ω·M | ≥1.0X1012 | ||
8 | 相(xiāng)對介電(diàn)常數(shù)48-62Hz | -- | 3.0-3.5 | ||
9 | 介(jiè)質損(sǔn)耗因數(shù)48-62Hz | -- | ≤0.002 | ||
二(èr)，應(yīng)用領(lǐng)域(yù)
6025E低熱膨脹(zhàng)係數聚酰亞胺薄膜(mó)其(qí)尺寸(cùn)穩定性高，CTE與銅箔(bó)相近特(tè)別(bié)適用於FPC行業製(zhì)作覆(fù)筒板需要。
6052E Low Expansion Coefficient Polyimide Film
With the application of Bi-axial stretching Technology, this brand polyimide film, the low thermal expansion coefficient polyimide film, is made from polyamic acid resins, which is obtained from a novel formula comprised of new anhydride monomers as well as a mine monomers. It not only processes good performance of ordinary polyimide film but also has better dimension stability, higher modulus of elasticity and lower heat expansion coefficient.
1. Technical Requirement
1.1 Thickness and Width
Thickness | 12.5 | 25.0 |
Tolerance | +1/-1 | +1/-2 |
| Width | ≤520 | ≤520 |
Notes: Thickness is supplied as the requests of customer | ||
1.2 Performace Index
No. | Index | Unit | Index Value | ||
12.5μm | 25.0μm | ||||
1 | Tensile | CD / MD | MPa | ≥200 | |
2 | Elongation | CD / MD | % | ≥40 | |
3 | Tensile modulus | CD / MD | GPa | ≥4.0 | |
| 4 | Heat expansion coefficient | % | ≤0.1 | ||
| 5 | Electrical operating frequency intensity | Average | MV/m | ≥200 | |
| 6 | Heat expansion coefficient 25-200℃ | ppm / ℃ | 15-25 | ||
5 | A wet sexual 100% RH | % | ≤2.5 | ||
6 | Volume resistivity 200℃ | Ω ·cm | ≥1.0X1012 | ||
7 | Relative dielectric constant 48-62Hz | -- | 3.0-3.5 | ||
8 | Dielectric loss factor 48-62Hz | -- | ≤0.002 | ||
2. Application
6052E low expansion coefficient polyimide film processes higher dimension stability. Its CTE is very near copper foil which is ideal material for FPC as copper board cover.
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